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A Differential Scanning Calorimeter measures heat flow to characterize polymers, rubbers, composites, and other materials. It quantifies Tg, melting and crystallization, Cp, thermal stability, and OIT. Built in our ISO 9001–certified facility in Dongguan with in-house machining and calibration, this DSC offers μW-level sensitivity, stable baselines, and software that supports routine testing and research.
With 17+ years of experience, utility model patents, and contributions to national standards, we provide dependable instruments and lifecycle support. OEM options, customization, and traceable calibration align the system with your methods, throughput, and budget. Global delivery reaches 50+ countries.
Select a heat-flux or power-compensated design. Depending on configuration, the temperature range can extend to 600°C with cooling down to about −150°C. Options include autosamplers, modulated DSC, automated N2/O2 switching, and software modules for QC or advanced R&D.
Provides robust, cost-effective measurements and excellent baseline stability for routine Tg, melting, crystallization, and OIT.
With mechanical refrigeration or LN2, typical range is −150 to 600°C. Controlled rates and μW-level sensitivity support accurate Cp and clear peak resolution.
Plastic compounding, resin curing studies, additive optimization, and thermal stability checks in automotive and electronics.
Delivers fast response and linearity for high-resolution analysis of overlapping transitions and kinetic studies.
Fine power control and low noise enable precise Tg, enthalpy, recrystallization, and detection of small thermal events.
Advanced resins, carbon-fiber composites, and formulations with minor transitions or multi-peak behavior.
Add modulated DSC to separate reversing/non-reversing signals, autosamplers for throughput, gas switching for inert/oxidative work, cooling via LN2 or chiller, and pans/crucibles for polymers, metals, and liquids.
Tightly controlled ramps and isothermal holds support accurate onset and peak determinations and simplify method transfer.
Low-drift baselines and μW-level sensitivity improve detection of subtle enthalpy changes and OIT behavior.
Intuitive tools support baseline correction, peak integration, Cp per ASTM E1269, kinetic analysis, and batch reporting.
Over-temperature protection, purge gas monitoring, and traceable factory calibration promote consistent performance.
Templates cover Tg, melting/crystallization, enthalpy, OIT, and Cp for plastics.
Pre-set sequences streamline polymer transitions and Cp determination.
Reference materials and procedures maintain accurate temperature and enthalpy scales.
Assess Tg, melting point, crystallization behavior, crystallinity, and OIT for polyolefins and engineering materials.
Evaluate curing kinetics, residual cure, and post-cure strategies for epoxy, polyester, and high-performance resins.
Characterize transitions, compatibility, and stability in multilayer films, PSAs, and protective coatings.
Match sub-ambient capability and upper limits to your samples; choose LN2 or mechanical cooling based on availability and ramp needs.
Select heat-flux vs power-compensated designs according to baseline behavior, response time, and event size.
Autosamplers and pre-programmed sequences raise productivity for routine QC; modular software supports teams.
Automated switching enables inert and oxidative studies for OIT and degradation analysis.
Tailor furnaces, sensors, pans, and software modules to standards or workflows; precision assembly enables fast turnaround.
Deliveries to 50+ countries with distributor support, spare parts, and remote diagnostics help minimize downtime.
Heat-flux and power-compensated designs measure heat flow differently; choose based on sensitivity needs, baseline behavior, and method tradition (ISO 11357, ASTM).
Access datasheets, method templates, and application notes. Integrate the DSC with TGA and sample prep tools for complete thermal analysis workflows.
Use heat-flux for robust baselines and routine workflows; choose power-compensated when resolving overlapping transitions or small events is critical.
LN2 achieves the lowest temperatures and fast sub-ambient ramps; mechanical systems simplify operation where ultra-low temperatures are not required.
Discuss your application or request a quote to configure a system that fits your methods, materials, and lab workflow.
